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HW-02-08-L-D-250-SM-A

HW-02-08-L-D-250-SM-A
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specificazioni

categorie
Board to Board & Mezzanine Connectors
Application
Elevated Board Stacking
Contact Material
Phosphor Bronze
Contact Plating
Gold
Flammability Rating
UL 94 V-0
Housing Material
Liquid Crystal Polymer (LCP)
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 55 C
Mounting Angle
Straight
Mounting Style
Mounting Peg
Number of Positions
4 Position
Number of Rows
2 Row
Packaging
Bulk
Pitch
2.54 mm
Product
Headers
Product Type
Board to Board & Mezzanine Connectors
Series
HW
Stack Height
6.35 mm
Termination Style
SMD/SMT
Tradename
Flex Stack

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HW-02-08-L-D-250-SM-A Notizie

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Parole chiave correlate per HW-0

  • HW-02-08-L-D-250-SM-A integrato
  • HW-02-08-L-D-250-SM-A RoHS
  • HW-02-08-L-D-250-SM-A Scheda tecnica PDF
  • HW-02-08-L-D-250-SM-A Scheda dati
  • HW-02-08-L-D-250-SM-A Parte
  • HW-02-08-L-D-250-SM-A Acquistare
  • HW-02-08-L-D-250-SM-A Distributore
  • HW-02-08-L-D-250-SM-A PDF
  • HW-02-08-L-D-250-SM-A Componente
  • HW-02-08-L-D-250-SM-A circuiti integrati
  • HW-02-08-L-D-250-SM-A Scarica il pdf
  • HW-02-08-L-D-250-SM-A Scarica la scheda tecnica
  • HW-02-08-L-D-250-SM-A Fornitura
  • HW-02-08-L-D-250-SM-A Fornitore
  • HW-02-08-L-D-250-SM-A Prezzo
  • HW-02-08-L-D-250-SM-A Scheda dati
  • HW-02-08-L-D-250-SM-A Immagine
  • HW-02-08-L-D-250-SM-A Immagine
  • HW-02-08-L-D-250-SM-A Inventario
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  • HW-02-08-L-D-250-SM-A specificazione
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  • HW-02-08-L-D-250-SM-A Dati tecnici

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