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HW-02-08-T-S-250-SM

HW-02-08-T-S-250-SM
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specificazioni

categorie
Board to Board & Mezzanine Connectors
Application
Elevated Board Stacking
Contact Material
Phosphor Bronze
Contact Plating
Tin
Flammability Rating
UL 94 V-0
Housing Material
Liquid Crystal Polymer (LCP)
Maximum Operating Temperature
+ 105 C
Minimum Operating Temperature
- 55 C
Mounting Angle
Straight
Mounting Style
SMD
Number of Positions
2 Position
Number of Rows
1 Row
Packaging
Bulk
Pitch
2.54 mm
Product
Headers
Product Type
Board to Board & Mezzanine Connectors
Series
HW
Stack Height
6.35 mm
Termination Style
SMD/SMT
Tradename
Flex Stack

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Ultime Recensioni

Scrivi il tuo dominio
goods very well received very good quality
Takes 8 days to Japan. Good!
packed pretty good, all is ok,-seller.
Thank You all fine, packed very well
Decent quality, not минвелл certainly, but enough decent
Di Più

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HW-02-08-T-S-250-SM Notizie

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Parole chiave correlate per HW-0

  • HW-02-08-T-S-250-SM integrato
  • HW-02-08-T-S-250-SM RoHS
  • HW-02-08-T-S-250-SM Scheda tecnica PDF
  • HW-02-08-T-S-250-SM Scheda dati
  • HW-02-08-T-S-250-SM Parte
  • HW-02-08-T-S-250-SM Acquistare
  • HW-02-08-T-S-250-SM Distributore
  • HW-02-08-T-S-250-SM PDF
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  • HW-02-08-T-S-250-SM circuiti integrati
  • HW-02-08-T-S-250-SM Scarica il pdf
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  • HW-02-08-T-S-250-SM Prezzo
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