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HW-01-08-G-S-235-120

HW-01-08-G-S-235-120
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specificazioni

categorie
Board to Board & Mezzanine Connectors
Application
Elevated Board Stacking
Contact Material
Phosphor Bronze
Contact Plating
Gold
Flammability Rating
UL 94 V-0
Housing Material
Liquid Crystal Polymer (LCP)
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 55 C
Mounting Angle
Straight
Mounting Style
Straight Pin
Number of Positions
1 Position
Number of Rows
1 Row
Packaging
Bulk
Pitch
2.54 mm
Product
Headers
Product Type
Board to Board & Mezzanine Connectors
Series
HW
Stack Height
5.969 mm
Termination Style
Through Hole
Tradename
Flex Stack

Categoria di Porduct

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Ultime Recensioni

Scrivi il tuo dominio
Article fits the description on the website and it is good quality. Free in 5 days in France well protected in a bubble envelope. Each value is row in a small bag zip. Trés satisfied with my purchase, I recommend this article and this supplier.
Product well received and very quickly for France, all is in order in perfect condition. Thank you. I recommend this company.
Perfectly.
The goods are OK, thank you dealers.
Thank you for the help in the selection of the correct driver, connect, works, not heated perfectly!
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HW-01-08-G-S-235-120 Notizie

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Parole chiave correlate per HW-0

  • HW-01-08-G-S-235-120 integrato
  • HW-01-08-G-S-235-120 RoHS
  • HW-01-08-G-S-235-120 Scheda tecnica PDF
  • HW-01-08-G-S-235-120 Scheda dati
  • HW-01-08-G-S-235-120 Parte
  • HW-01-08-G-S-235-120 Acquistare
  • HW-01-08-G-S-235-120 Distributore
  • HW-01-08-G-S-235-120 PDF
  • HW-01-08-G-S-235-120 Componente
  • HW-01-08-G-S-235-120 circuiti integrati
  • HW-01-08-G-S-235-120 Scarica il pdf
  • HW-01-08-G-S-235-120 Scarica la scheda tecnica
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  • HW-01-08-G-S-235-120 Prezzo
  • HW-01-08-G-S-235-120 Scheda dati
  • HW-01-08-G-S-235-120 Immagine
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